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1 Ergebnisse
1
A Rigorous-Simulation-Driven OPC Solution Was Built Before ..:
, In:
2023 International Workshop on Advanced Patterning Solutions (IWAPS)
,
Meng, Xiaodong
;
Chen, Cai
;
Li, Edward
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/IWAPS60466.2023.10366120
RT T1 <cTitle>2023 International Workshop on Advanced Patterning Solutions (IWAPS)</cTitle>: T1 <Title>A Rigorous-Simulation-Driven OPC Solution Was Built Before Obtaining Real Wafer Data</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10366120&Exemplar=1&LAN=DE A1 Meng, Xiaodong A1 Chen, Cai A1 Li, Edward A1 Chen, Lei A1 Wang, Zilong A1 Zhu, Liang YR 2023 K1 Semiconductor device modeling K1 Semiconductor device measurement K1 Lithography K1 Semiconductor device reliability K1 Production K1 Silicon K1 Semiconductor process modeling K1 Rigorous Simulation K1 OPC K1 Quasi-Wafer Data SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IWAPS60466.2023.10366120 DO https://doi.org/10.1109/IWAPS60466.2023.10366120 SF ELIB - SuUB Bremen
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