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1 Ergebnisse
1
Exploration charge effect and wafer backside materials corr..:
, In:
2023 International Workshop on Advanced Patterning Solutions (IWAPS)
,
Song, Zhaojie
;
Ding, Kai
;
Hu, Shancheng
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/IWAPS60466.2023.10366130
RT T1 <cTitle>2023 International Workshop on Advanced Patterning Solutions (IWAPS)</cTitle>: T1 <Title>Exploration charge effect and wafer backside materials correlation to Diamond-Like Carbon wafer table degradation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10366130&Exemplar=1&LAN=DE A1 Song, Zhaojie A1 Ding, Kai A1 Hu, Shancheng A1 Zhao, Stone A1 Zhang, Leslie A1 Jiang, Shifeng YR 2023 K1 Degradation K1 Resistance K1 Voltage measurement K1 Correlation K1 Corrosion K1 Lithography K1 Random access memory K1 Back Side Treatment K1 Charge K1 Diamond-Like Carbon K1 Wafer Load Grid K1 Wafer Table SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IWAPS60466.2023.10366130 DO https://doi.org/10.1109/IWAPS60466.2023.10366130 SF ELIB - SuUB Bremen
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