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1 Ergebnisse
1
Rigorous Simulation for Impact of Self-Aligned Multiple Pat..:
, In:
2023 International Workshop on Advanced Patterning Solutions (IWAPS)
,
Yao, Mingyi
;
Qi, Yuejing
;
Zhou, Guangying
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/IWAPS60466.2023.10366168
RT T1
2023 International Workshop on Advanced Patterning Solutions (IWAPS)
: T1
Rigorous Simulation for Impact of Self-Aligned Multiple Patterning on Alignment
UL https://suche.suub.uni-bremen.de/peid=ieee-10366168&Exemplar=1&LAN=DE A1 Yao, Mingyi A1 Qi, Yuejing A1 Zhou, Guangying A1 Li, Liang A1 Jiang, Miao A1 Shi, Elly YR 2023 K1 Semiconductor device modeling K1 Integrated circuits K1 Analytical models K1 Conferences K1 Production K1 Interference K1 Manufacturing K1 Alignment K1 SAMP K1 Wafer Quality K1 Film Stack SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IWAPS60466.2023.10366168 DO https://doi.org/10.1109/IWAPS60466.2023.10366168 SF ELIB - SuUB Bremen
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