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1 Ergebnisse
1
AI-Enhanced Modal Decomposition Method for Fast and Efficie..:
, In:
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC)
,
Gao, Zhaodong
;
Su, Ming
;
Guo, Xingyue
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ISEMC58300.2023.10370118
RT T1 <cTitle>2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC)</cTitle>: T1 <Title>AI-Enhanced Modal Decomposition Method for Fast and Efficient PCB Modeling and Signal Integrity</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10370118&Exemplar=1&LAN=DE A1 Gao, Zhaodong A1 Su, Ming A1 Guo, Xingyue A1 Chen, Xilian A1 Yan, Chuming A1 Liu, Yuanan YR 2023 K1 Electric potential K1 Computational modeling K1 Measurement uncertainty K1 Computer architecture K1 Predictive models K1 Electromagnetic compatibility K1 Data models K1 PCB Modeling K1 Signal Integrity K1 Modal Decomposition K1 Machine learning K1 Artificial Intelligence SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ISEMC58300.2023.10370118 DO https://doi.org/10.1109/ISEMC58300.2023.10370118 SF ELIB - SuUB Bremen
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