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1 Ergebnisse
1
Research on Equivalent Modeling and Simulation Method of Su..:
, In:
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC)
,
Chengchao, Hua
;
Chen, Huang
;
Chunyu, Yang
. - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ISEMC58300.2023.10370147
RT T1 <cTitle>2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC)</cTitle>: T1 <Title>Research on Equivalent Modeling and Simulation Method of Surface Current Distribution of Metal</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10370147&Exemplar=1&LAN=DE A1 Chengchao, Hua A1 Chen, Huang A1 Chunyu, Yang A1 Peng, Yang YR 2023 K1 Analytical models K1 Simulation K1 Metals K1 Current distribution K1 Electromagnetic compatibility K1 Software K1 Integrated circuit modeling K1 surface current K1 partial element equivalent circuits K1 field-path coupling K1 Simulation calculations SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ISEMC58300.2023.10370147 DO https://doi.org/10.1109/ISEMC58300.2023.10370147 SF ELIB - SuUB Bremen
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