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1 Ergebnisse
1
Investigation of impedance compensation for inductive via h..:
, In:
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC)
,
Wang, Ziren
;
Chen, Lin
;
An, Shaogeng
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ISEMC58300.2023.10370250
RT T1 <cTitle>2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC)</cTitle>: T1 <Title>Investigation of impedance compensation for inductive via holes using capacitors</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10370250&Exemplar=1&LAN=DE A1 Wang, Ziren A1 Chen, Lin A1 An, Shaogeng A1 Meng, Meng A1 Chen, Zhe A1 Wang, Shouyuan A1 Jin, Qiuyan YR 2023 K1 Grounding K1 Capacitors K1 Printed circuits K1 Resonant frequency K1 RLC circuits K1 Electromagnetic compatibility K1 Impedance K1 Signal integrity K1 via hole K1 impedance compensation K1 capacitor SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ISEMC58300.2023.10370250 DO https://doi.org/10.1109/ISEMC58300.2023.10370250 SF ELIB - SuUB Bremen
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