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1 Ergebnisse
1
Simulation and experiment of microstrip lines temperature r..:
, In:
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC)
,
Huang, Lijuan
;
Liao, Jinfu
;
Fang, Wenxiao
. - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ISEMC58300.2023.10370330
RT T1 <cTitle>2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC)</cTitle>: T1 <Title>Simulation and experiment of microstrip lines temperature rise based on COMSOL Multiphysics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10370330&Exemplar=1&LAN=DE A1 Huang, Lijuan A1 Liao, Jinfu A1 Fang, Wenxiao A1 Wang, Jianying YR 2023 K1 Temperature measurement K1 Strips K1 Temperature K1 Simulation K1 Infrared heating K1 Fitting K1 Conductors K1 Microstrip line K1 temperature rise K1 COMSOL Multiphysics K1 electrothermal interaction SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ISEMC58300.2023.10370330 DO https://doi.org/10.1109/ISEMC58300.2023.10370330 SF ELIB - SuUB Bremen
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