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1 Ergebnisse
1
Analysis of the Damage Characteristics of Integrated Circui..:
, In:
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC)
,
Lu, Fu
;
Zhaowen, Yan
- p. 1-6 , 2023
Link:
https://doi.org/10.1109/ISEMC58300.2023.10370508
RT T1 <cTitle>2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC)</cTitle>: T1 <Title>Analysis of the Damage Characteristics of Integrated Circuits with Various Pulse Width</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10370508&Exemplar=1&LAN=DE A1 Lu, Fu A1 Zhaowen, Yan YR 2023 K1 Integrated circuits K1 Interference K1 Electromagnetic compatibility K1 Electrostatic discharges K1 Transient analysis K1 integrated circuits (ICs) K1 transmission line pulse(TLP) K1 transient damage characteristics K1 transient IV curves SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ISEMC58300.2023.10370508 DO https://doi.org/10.1109/ISEMC58300.2023.10370508 SF ELIB - SuUB Bremen
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