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1 Ergebnisse
1
Reliability Analysis of Power Integrated Circuits Using Fin..:
, In:
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC)
,
Zhang, Fan
;
Feng, Ming-Ze
;
Zhou, Jia-Hao
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ISEMC58300.2023.10370630
RT T1 <cTitle>2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC)</cTitle>: T1 <Title>Reliability Analysis of Power Integrated Circuits Using Finite Element Method with Hybrid Mesh</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10370630&Exemplar=1&LAN=DE A1 Zhang, Fan A1 Feng, Ming-Ze A1 Zhou, Jia-Hao A1 Li, Bing-Heng A1 Pu, Bo A1 Chu, Xiu-Qin YR 2023 K1 Resistors K1 Resistance K1 Reliability engineering K1 Hybrid power systems K1 Software K1 Finite element analysis K1 Software reliability K1 Power integrated circuits K1 reliability analysis K1 finite element method K1 hybrid mesh SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ISEMC58300.2023.10370630 DO https://doi.org/10.1109/ISEMC58300.2023.10370630 SF ELIB - SuUB Bremen
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