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1
Enhancing Semiconductor Chip Image Defect Classification Us..:
, In:
2023 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, Automation and Mechatronics (RAM)
,
Zheng, Xiaoyan
;
Sang, Tong
;
Chen, Ruohui
. - p. 204-209 , 2023
Link:
https://doi.org/10.1109/CIS-RAM55796.2023.10370751
RT T1 <cTitle>2023 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, Automation and Mechatronics (RAM)</cTitle>: T1 <Title>Enhancing Semiconductor Chip Image Defect Classification Using Deep Learning and Segmented Defect Region Information</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10370751&Exemplar=1&LAN=DE A1 Zheng, Xiaoyan A1 Sang, Tong A1 Chen, Ruohui A1 Zeng, Zeng YR 2023 SN 2326-8239 K1 Semiconductor device modeling K1 Deep learning K1 Image segmentation K1 Manufacturing processes K1 Image recognition K1 Costs K1 Merging K1 Image classification K1 Segmentation-guided classification K1 Semiconductor imaging SP 204 OP 209 LK http://dx.doi.org/https://doi.org/10.1109/CIS-RAM55796.2023.10370751 DO https://doi.org/10.1109/CIS-RAM55796.2023.10370751 SF ELIB - SuUB Bremen
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