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1 Ergebnisse
1
A Gold Bump Flip-chip Interconnection Structure for Face-up..:
, In:
2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
,
Yu, Huaiqiang
;
Peng, Jiahong
;
Wang, Xi
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/IMWS-AMP57814.2023.10381227
RT T1 <cTitle>2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)</cTitle>: T1 <Title>A Gold Bump Flip-chip Interconnection Structure for Face-up MMIC Assembly in RF Front-end Modules</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10381227&Exemplar=1&LAN=DE A1 Yu, Huaiqiang A1 Peng, Jiahong A1 Wang, Xi A1 Tan, Yuting A1 Wen, Peng A1 Tao, Yi A1 Deng, Like A1 Jiang, Chuangxin YR 2023 SN 2694-2992 K1 Radio frequency K1 Gold K1 Integrated circuit interconnections K1 Prototypes K1 Insertion loss K1 Microwave theory and techniques K1 Microwave circuits K1 flip chip K1 face-up K1 gold bump K1 monolithic microwave integrated circuit (MMIC) K1 front-end module (FEM) SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/IMWS-AMP57814.2023.10381227 DO https://doi.org/10.1109/IMWS-AMP57814.2023.10381227 SF ELIB - SuUB Bremen
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