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Silicon Bridge for High-Level RF Microsystem Package and Mi..:

, In: 2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP),
Yang, Xiaodong ; Sun, Xiangyu ; Lu, Yaobing - p. 1-2 , 2023
Link: https://doi.org/10.1109/IMWS-AMP57814.2023.10381454