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1 Ergebnisse
1
Packaging of 15-kV Silicon Carbide Half-Bridge Module Enabl..:
, In:
2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)
,
Zhang, Zichen
;
Lu, Shengchang
;
Nicholas, Carl
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/WiPDA58524.2023.10382197
RT T1
2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)
: T1
Packaging of 15-kV Silicon Carbide Half-Bridge Module Enabled by a Nonlinear Resistive Polymer Nanocomposite Field-Grading Coating
UL https://suche.suub.uni-bremen.de/peid=ieee-10382197&Exemplar=1&LAN=DE A1 Zhang, Zichen A1 Lu, Shengchang A1 Nicholas, Carl A1 Lynch, Justin A1 Morgan, Adam A1 Sung, Woongje A1 Ngo, Khai D.T. A1 Lu, Guo-Quan YR 2023 SN 2687-8577 K1 Silicon carbide K1 Prototypes K1 Voltage K1 Medium voltage K1 Switches K1 Power electronics K1 Polymers K1 medium-voltage power module K1 insulation design K1 nonlinear resistive polymer nanocomposite K1 field grading K1 partial discharge SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/WiPDA58524.2023.10382197 DO https://doi.org/10.1109/WiPDA58524.2023.10382197 SF ELIB - SuUB Bremen
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