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1
Thermal Noise Analysis of Accumulation-based S/H Circuit fo..:
, In:
2023 30th IEEE International Conference on Electronics, Circuits and Systems (ICECS)
,
Yarragunta, Jaya Satyanarayana
;
Aprile, Antonio
;
Fugger, Andreas
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICECS58634.2023.10382882
RT T1 <cTitle>2023 30th IEEE International Conference on Electronics, Circuits and Systems (ICECS)</cTitle>: T1 <Title>Thermal Noise Analysis of Accumulation-based S/H Circuit for Shunt Current Sensing</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10382882&Exemplar=1&LAN=DE A1 Yarragunta, Jaya Satyanarayana A1 Aprile, Antonio A1 Fugger, Andreas A1 Conzatti, Francesco A1 Bonizzoni, Edoardo A1 Malcovati, Piero YR 2023 K1 Resistors K1 Voltage measurement K1 Current measurement K1 Simulation K1 Noise reduction K1 Thermal noise K1 Thermal analysis SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICECS58634.2023.10382882 DO https://doi.org/10.1109/ICECS58634.2023.10382882 SF ELIB - SuUB Bremen
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