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1 Ergebnisse
1
Enhanced Thermal Performance of Power Module with Integrate..:
, In:
2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)
,
Wang, Liang
;
Xu, Mingyu
;
Li, Miaomiao
... - p. 1695-1700 , 2023
Link:
https://doi.org/10.1109/PEAS58692.2023.10394736
RT T1 <cTitle>2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)</cTitle>: T1 <Title>Enhanced Thermal Performance of Power Module with Integrated AlN Ceramic Heatsink</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10394736&Exemplar=1&LAN=DE A1 Wang, Liang A1 Xu, Mingyu A1 Li, Miaomiao A1 Gong, Jiakun A1 Liang, Senhao A1 Zhang, Jiawei A1 Zeng, Zheng YR 2023 K1 Performance evaluation K1 Thermal resistance K1 Multichip modules K1 Electronic packaging thermal management K1 Ceramics K1 III-V semiconductor materials K1 Junctions K1 Power module K1 thermal resistance K1 junction temperature K1 ceramic heatsink K1 thermal enhancement SP 1695 OP 1700 LK http://dx.doi.org/https://doi.org/10.1109/PEAS58692.2023.10394736 DO https://doi.org/10.1109/PEAS58692.2023.10394736 SF ELIB - SuUB Bremen
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