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1 Ergebnisse
1
Transient Thermal Management of Press-Pack Thyristors Using..:
, In:
2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)
,
Chen, Honggang
;
Cheng, Jingpeng
;
Wei, Jinxiao
.. - p. 1701-1705 , 2023
Link:
https://doi.org/10.1109/PEAS58692.2023.10394817
RT T1 <cTitle>2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)</cTitle>: T1 <Title>Transient Thermal Management of Press-Pack Thyristors Using Stacked Structure and Phase Change Material</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10394817&Exemplar=1&LAN=DE A1 Chen, Honggang A1 Cheng, Jingpeng A1 Wei, Jinxiao A1 Feng, Hao A1 Ran, Li YR 2023 K1 Phase change materials K1 Heating systems K1 Thyristors K1 Power demand K1 Electronic packaging thermal management K1 Power electronics K1 Thermal analysis K1 static synchronous series compensator (SSSC) K1 press-pack thyristor K1 a stacked structure K1 phase change material (PCM) K1 overcurrent capability SP 1701 OP 1705 LK http://dx.doi.org/https://doi.org/10.1109/PEAS58692.2023.10394817 DO https://doi.org/10.1109/PEAS58692.2023.10394817 SF ELIB - SuUB Bremen
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