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1 Ergebnisse
1
Design and Modeling of the PCB Rogowski Coil with Multiple ..:
, In:
2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)
,
Shi, Yafei
;
Xin, Zhen
;
Zhou, Ze
. - p. 1072-1076 , 2023
Link:
https://doi.org/10.1109/PEAS58692.2023.10394851
RT T1 <cTitle>2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)</cTitle>: T1 <Title>Design and Modeling of the PCB Rogowski Coil with Multiple Vias for Power Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10394851&Exemplar=1&LAN=DE A1 Shi, Yafei A1 Xin, Zhen A1 Zhou, Ze A1 Yao, Yu YR 2023 K1 Performance evaluation K1 Inductance K1 Impedance measurement K1 Sensitivity K1 Windings K1 Printed circuits K1 Network analyzers K1 Printed Circuit Board (PCB) Rogowski coil K1 parasitic inductance K1 parasitic capacitance K1 bandwidth SP 1072 OP 1076 LK http://dx.doi.org/https://doi.org/10.1109/PEAS58692.2023.10394851 DO https://doi.org/10.1109/PEAS58692.2023.10394851 SF ELIB - SuUB Bremen
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