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1 Ergebnisse
1
Ageing Bonding Wires Equivalent Resistance Change Law Based..:
, In:
2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)
,
Hu, Jingwei
;
Yan, Zhengqing
;
Xia, Hengwei
... - p. 258-263 , 2023
Link:
https://doi.org/10.1109/PEAS58692.2023.10394959
RT T1 <cTitle>2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)</cTitle>: T1 <Title>Ageing Bonding Wires Equivalent Resistance Change Law Based on Temperature Distribution Coefficient</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10394959&Exemplar=1&LAN=DE A1 Hu, Jingwei A1 Yan, Zhengqing A1 Xia, Hengwei A1 Sun, Xiepeng A1 Du, Mingxing A1 Meng, Qingtao YR 2023 K1 Temperature measurement K1 Insulated gate bipolar transistors K1 Temperature sensors K1 Temperature distribution K1 Wires K1 Aging K1 Bonding K1 IGBT K1 bonding wire aging K1 temperature distribution coefficient K1 parameter extraction K1 bond wire equivalent resistance SP 258 OP 263 LK http://dx.doi.org/https://doi.org/10.1109/PEAS58692.2023.10394959 DO https://doi.org/10.1109/PEAS58692.2023.10394959 SF ELIB - SuUB Bremen
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