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1 Ergebnisse
1
Simulation of Thermal Distribution in SiC Power Modules wit..:
, In:
2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)
,
Hui, Xiaoshuang
;
Ning, Puqi
;
Fan, Tao
... - p. 1659-1664 , 2023
Link:
https://doi.org/10.1109/PEAS58692.2023.10395634
RT T1 <cTitle>2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)</cTitle>: T1 <Title>Simulation of Thermal Distribution in SiC Power Modules with Pinfin Heatsink Based on Lattice Boltzmann Method</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10395634&Exemplar=1&LAN=DE A1 Hui, Xiaoshuang A1 Ning, Puqi A1 Fan, Tao A1 Wang, Kai A1 Mei, Yunhui A1 Lei, Guangyin YR 2023 K1 Solid modeling K1 Silicon carbide K1 Computational modeling K1 Cogeneration K1 Multichip modules K1 Software K1 Junctions K1 power modules K1 junction temperature K1 lattice Boltzmann method K1 pinfin heat sink SP 1659 OP 1664 LK http://dx.doi.org/https://doi.org/10.1109/PEAS58692.2023.10395634 DO https://doi.org/10.1109/PEAS58692.2023.10395634 SF ELIB - SuUB Bremen
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