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1 Ergebnisse
1
A GaN HEMT Integrated Power Module with Silver Sintering Pr..:
, In:
2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)
,
Dong, Zezheng
;
Fan, Yinxiang
;
Yan, Haidong
. - p. 843-848 , 2023
Link:
https://doi.org/10.1109/PEAS58692.2023.10395709
RT T1 <cTitle>2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)</cTitle>: T1 <Title>A GaN HEMT Integrated Power Module with Silver Sintering Processes</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10395709&Exemplar=1&LAN=DE A1 Dong, Zezheng A1 Fan, Yinxiang A1 Yan, Haidong A1 Wu, Xinke YR 2023 K1 Silver K1 Thermal resistance K1 Sintering K1 Multichip modules K1 HEMTs K1 Logic gates K1 Electronic packaging thermal management K1 Gallium nitride K1 integrated power module K1 silver sintering K1 parasitic inductance K1 thermal resistance SP 843 OP 848 LK http://dx.doi.org/https://doi.org/10.1109/PEAS58692.2023.10395709 DO https://doi.org/10.1109/PEAS58692.2023.10395709 SF ELIB - SuUB Bremen
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