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1 Ergebnisse
1
Signal integrity analysis of heterogeneous integration usin..:
, In:
2023 20th International SoC Design Conference (ISOCC)
,
Koh, Yong-Nam
;
Kim, Ju-Hyung
;
Kim, Soo-Jeong
... - p. 221-222 , 2023
Link:
https://doi.org/10.1109/ISOCC59558.2023.10396233
RT T1
2023 20th International SoC Design Conference (ISOCC)
: T1
Signal integrity analysis of heterogeneous integration using Si bridge technology
UL https://suche.suub.uni-bremen.de/peid=ieee-10396233&Exemplar=1&LAN=DE A1 Koh, Yong-Nam A1 Kim, Ju-Hyung A1 Kim, Soo-Jeong A1 Jang, Ju-Hwan A1 Lim, Jae-Sung A1 Kim, Jayden Donghyun YR 2023 SN 2472-9655 K1 Bridges K1 Wiring K1 Integrated circuits K1 Simulation K1 Multichip modules K1 Bandwidth K1 Trademarks K1 2.5D advanced packaging technology K1 Heterogeneous Integration K1 Silicon Bridge K1 Neural Processing Unit K1 High Bandwidth Memory K1 Signal Integrity K1 Electrical simulation SP 221 OP 222 LK http://dx.doi.org/https://doi.org/10.1109/ISOCC59558.2023.10396233 DO https://doi.org/10.1109/ISOCC59558.2023.10396233 SF ELIB - SuUB Bremen
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