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1 Ergebnisse
1
Transient Thermodynamic Simulation of Micro LED Array Bondi..:
, In:
2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)
,
Pan, Jinwen
;
Zhou, Haojie
;
Ji, Xiaoxiao
... - p. 357-360 , 2023
Link:
https://doi.org/10.1109/SSLChinaIFWS60785.2023.1039964
RT T1 <cTitle>2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)</cTitle>: T1 <Title>Transient Thermodynamic Simulation of Micro LED Array Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10399648&Exemplar=1&LAN=DE A1 Pan, Jinwen A1 Zhou, Haojie A1 Ji, Xiaoxiao A1 Chen, Liang A1 Yin, Luqiao A1 Zhang, Jianhua YR 2023 K1 Thermodynamics K1 Cooling K1 Photonic band gap K1 Light emitting diodes K1 Residual stresses K1 Reliability K1 Bonding SP 357 OP 360 LK http://dx.doi.org/https://doi.org/10.1109/SSLChinaIFWS60785.2023.10399648 DO https://doi.org/10.1109/SSLChinaIFWS60785.2023.10399648 SF ELIB - SuUB Bremen
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