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1 Ergebnisse
1
Hybrid bonding thermodynamic simulation of 3×3 array of Mic..:
, In:
2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)
,
Li, Jianxin
;
Zhou, Haojie
;
Ji, Xiaoxiao
.. - p. 330-332 , 2023
Link:
https://doi.org/10.1109/SSLChinaIFWS60785.2023.1039965
RT T1 <cTitle>2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)</cTitle>: T1 <Title>Hybrid bonding thermodynamic simulation of 3×3 array of Micro-LED fabricated based on flip-chip bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10399659&Exemplar=1&LAN=DE A1 Li, Jianxin A1 Zhou, Haojie A1 Ji, Xiaoxiao A1 Yin, Luqiao A1 Zhang, Jianhua YR 2023 K1 Silicon compounds K1 Thermodynamics K1 Photonic band gap K1 Light emitting diodes K1 Filling K1 Manufacturing K1 Flip-chip devices SP 330 OP 332 LK http://dx.doi.org/https://doi.org/10.1109/SSLChinaIFWS60785.2023.10399659 DO https://doi.org/10.1109/SSLChinaIFWS60785.2023.10399659 SF ELIB - SuUB Bremen
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