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1
Thermal Management of GaN Power Modules Using Copper Core P..:
, In:
2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)
,
Liang, Jingyuan
;
Liu, Qi
;
Cui, Wentao
. - p. 259-262 , 2023
Link:
https://doi.org/10.1109/SSLChinaIFWS60785.2023.1039974
RT T1 <cTitle>2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)</cTitle>: T1 <Title>Thermal Management of GaN Power Modules Using Copper Core PCBs with Direct Heatsink Pads</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10399745&Exemplar=1&LAN=DE A1 Liang, Jingyuan A1 Liu, Qi A1 Cui, Wentao A1 Ng, Wai Tung YR 2023 K1 Heating systems K1 Power system measurements K1 Buck converters K1 Density measurement K1 Multichip modules K1 HEMTs K1 Transistors SP 259 OP 262 LK http://dx.doi.org/https://doi.org/10.1109/SSLChinaIFWS60785.2023.10399745 DO https://doi.org/10.1109/SSLChinaIFWS60785.2023.10399745 SF ELIB - SuUB Bremen
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