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1 Ergebnisse
1
Improvement In Thermal Issue By Using Suitable Dielectric M..:
, In:
2023 International Conference on Computational Intelligence for Information, Security and Communication Applications (CIISCA)
,
Venkata Meghana, Galidevara Sai
;
Chitrush, Gangineni
;
Kumar, Racharla Akshay
. - p. 24-29 , 2023
Link:
https://doi.org/10.1109/CIISCA59740.2023.00015
RT T1 <cTitle>2023 International Conference on Computational Intelligence for Information, Security and Communication Applications (CIISCA)</cTitle>: T1 <Title>Improvement In Thermal Issue By Using Suitable Dielectric Material And Core For Future IC Integration Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10403622&Exemplar=1&LAN=DE A1 Venkata Meghana, Galidevara Sai A1 Chitrush, Gangineni A1 Kumar, Racharla Akshay A1 Panigrahy, Asisa Kumar YR 2023 K1 Silicon compounds K1 Dielectric materials K1 Conductivity K1 Thermal conductivity K1 Dielectrics K1 Through-silicon vias K1 Heat sinks K1 TTSV K1 thermal K1 3DIC K1 Heat mitigation SP 24 OP 29 LK http://dx.doi.org/https://doi.org/10.1109/CIISCA59740.2023.00015 DO https://doi.org/10.1109/CIISCA59740.2023.00015 SF ELIB - SuUB Bremen
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