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1 Ergebnisse
1
A Resistive Sensor Interface IC with Inductively Coupled Wi..:
, In:
2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS)
,
Lan, Zehua
;
Shi, Jiahua
;
Li, Yaoyu
... - p. 753-757 , 2023
Link:
https://doi.org/10.1109/MWSCAS57524.2023.10406085
RT T1 <cTitle>2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS)</cTitle>: T1 <Title>A Resistive Sensor Interface IC with Inductively Coupled Wireless Energy Harvesting and Data Telemetry for Implantable Pressure Sensing</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10406085&Exemplar=1&LAN=DE A1 Lan, Zehua A1 Shi, Jiahua A1 Li, Yaoyu A1 Hao, Jiayue A1 Guo, Yanshu A1 Wang, Zhihua A1 Jiang, Hanjun A1 Jia, Wen YR 2023 SN 1558-3899 K1 Integrated circuits K1 Power demand K1 Sensors K1 System-on-chip K1 Pressure measurement K1 Telemetry K1 Backscatter K1 Implantable pressure sensor K1 resistance-to-time converter K1 resistive sensor readout K1 backscatter telemetry SP 753 OP 757 LK http://dx.doi.org/https://doi.org/10.1109/MWSCAS57524.2023.10406085 DO https://doi.org/10.1109/MWSCAS57524.2023.10406085 SF ELIB - SuUB Bremen
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