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1 Ergebnisse
1
1.2 kV SiC Wirebond-Less Integrated Low Inductance Module f..:
, In:
2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP)
,
De Giorgio, Massimo
;
Li, Ke
;
Marchant, Stewart
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/SPEC56436.2023.10408710
RT T1
2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP)
: T1
1.2 kV SiC Wirebond-Less Integrated Low Inductance Module for Automotive Application
UL https://suche.suub.uni-bremen.de/peid=ieee-10408710&Exemplar=1&LAN=DE A1 De Giorgio, Massimo A1 Li, Ke A1 Marchant, Stewart A1 de Lillo, Liliana A1 Empringham, Lee A1 Serafianos, Dimitrios A1 Lea, Jonathan A1 Brockway, Simon A1 Jonhson, Mark YR 2023 SN 2832-2983 K1 Schottky diodes K1 Inductance K1 Silicon carbide K1 Wires K1 Automotive applications K1 Multichip modules K1 Gate drivers K1 Silicon Carbide (SiC) K1 Intelligent Power Module (IPM) K1 wirebond-less power module K1 integration K1 parasitic inductance K1 Q3D extractor SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/SPEC56436.2023.10408710 DO https://doi.org/10.1109/SPEC56436.2023.10408710 SF ELIB - SuUB Bremen
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