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Dielectric, Thermal and Mechanical Properties of a Sequence..:

, In: 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP),
Haze, D. ; Kadlec, P. ; Polansky, R... - p. 1-4 , 2023
Link: https://doi.org/10.1109/CEIDP51414.2023.10410502