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1 Ergebnisse
1
Thermal dissipation in stacked devices:
, In:
2023 International Electron Devices Meeting (IEDM)
,
Woon, W. Y.
;
Vaziri, Sam
;
Shih, C. C.
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/IEDM45741.2023.10413721
RT T1
2023 International Electron Devices Meeting (IEDM)
: T1
Thermal dissipation in stacked devices
UL https://suche.suub.uni-bremen.de/peid=ieee-10413721&Exemplar=1&LAN=DE A1 Woon, W. Y. A1 Vaziri, Sam A1 Shih, C. C. A1 Datye, I. A1 Malakoutian, M. A1 Hsu, James A1 Yang, K. F. A1 Huang, J. R. A1 Shen, T. M. A1 Chowdhury, S. A1 Bao, X. Y. A1 Liao, S. S. YR 2023 SN 2156-017X K1 Three-dimensional displays K1 Diamonds K1 Conductivity K1 Thermal conductivity K1 Plasma temperature K1 III-V semiconductor materials K1 Aluminum nitride SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IEDM45741.2023.10413721 DO https://doi.org/10.1109/IEDM45741.2023.10413721 SF ELIB - SuUB Bremen
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