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1 Ergebnisse
1
Two-metal-level semi-damascene interconnect at metal pitch ..:
, In:
2023 International Electron Devices Meeting (IEDM)
,
Gupta, Anshul
;
Marti, Giulio
;
Delie, Gilles
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/IEDM45741.2023.10413784
RT T1
2023 International Electron Devices Meeting (IEDM)
: T1
Two-metal-level semi-damascene interconnect at metal pitch 18 nm and aspect-ratio 6 routed using fully self-aligned via
UL https://suche.suub.uni-bremen.de/peid=ieee-10413784&Exemplar=1&LAN=DE A1 Gupta, Anshul A1 Marti, Giulio A1 Delie, Gilles A1 Kundu, Souvik A1 Decoster, Stefan A1 Pedreira, Olalla Varela A1 Kenens, Bart A1 Farokhnejad, Anita A1 Hermans, Yannick A1 Wachter, Bart de A1 Gavrilov, Anton A1 Lesniewska, Alicja A1 Oniki, Yusuke A1 Pacco, Antoine A1 Murdoch, Gayle A1 Park, Seongho A1 Tokei, Zsolt YR 2023 SN 2156-017X K1 Resistance K1 Kelvin K1 Air gaps K1 Thermal shock K1 Conductors K1 Electrical resistance measurement K1 Reliability SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IEDM45741.2023.10413784 DO https://doi.org/10.1109/IEDM45741.2023.10413784 SF ELIB - SuUB Bremen
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