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1 Ergebnisse
1
Ultimate Layer Stacking Technology for High Density Sequent..:
, In:
2023 International Electron Devices Meeting (IEDM)
,
Radu, I.
;
Nguyen, B-Y.
;
Chang, C-H.
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/IEDM45741.2023.10413807
RT T1
2023 International Electron Devices Meeting (IEDM)
: T1
Ultimate Layer Stacking Technology for High Density Sequential 3D Integration
UL https://suche.suub.uni-bremen.de/peid=ieee-10413807&Exemplar=1&LAN=DE A1 Radu, I. A1 Nguyen, B-Y. A1 Chang, C-H. A1 Neve, C. Roda A1 Gaudin, G. A1 Besnard, G. A1 Batude, P. A1 Loup, V. A1 Brunet, L. A1 Vandooren, A. A1 Horiguchi, N. YR 2023 SN 2156-017X K1 Temperature measurement K1 Three-dimensional displays K1 Temperature K1 Stacking K1 Silicon K1 Transistors K1 MOS devices SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IEDM45741.2023.10413807 DO https://doi.org/10.1109/IEDM45741.2023.10413807 SF ELIB - SuUB Bremen
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