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CMOS-Fabricated Ring Surface Ion Trap with TSV Integration:

, In: 2023 International Electron Devices Meeting (IEDM),
Zhao, Peng ; Lim, Yu Dian ; Li, Hongyu... - p. 1-4 , 2023
Link: https://doi.org/10.1109/IEDM45741.2023.10413875