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1 Ergebnisse
1
Fine Pitch Micro Indium Bump Interconnect Flip Chip Bonding:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Scott, Travis
- p. 1-5 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418272
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Fine Pitch Micro Indium Bump Interconnect Flip Chip Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418272&Exemplar=1&LAN=DE A1 Scott, Travis YR 2023 K1 Industries K1 Program processors K1 Imaging K1 Production K1 Indium K1 Bonding K1 Sensor arrays K1 Focal Plane Array K1 Quantum K1 Super - computing K1 Fine pitch micro Indium bump K1 flip chip die bonding K1 hybridization K1 Monolithic - integration SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418272 DO https://doi.org/10.23919/EMPC55870.2023.10418272 SF ELIB - SuUB Bremen
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