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1 Ergebnisse
1
Analysis of the Impact of Environmental Conditions on the R..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Walter, Hans
;
Wittler, Olaf
;
Van Dijk, Marius
... - p. 1-7 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418283
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Analysis of the Impact of Environmental Conditions on the Reliability in 5G PCB Assemblies</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418283&Exemplar=1&LAN=DE A1 Walter, Hans A1 Wittler, Olaf A1 Van Dijk, Marius A1 Huber, Saskia A1 Julia-Marie-Koszegi A1 Schneider-Ramelow, Martin YR 2023 K1 Degradation K1 Temperature measurement K1 Temperature K1 Image color analysis K1 5G mobile communication K1 Dielectrics K1 Millimeter wave communication K1 PCB K1 RF K1 Robustness K1 5G K1 Warpage K1 Dielectric K1 Mechanical K1 Ageing effects SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418283 DO https://doi.org/10.23919/EMPC55870.2023.10418283 SF ELIB - SuUB Bremen
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