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Development and Characterizations of Fine Pitch Flip-Chip I..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Gougeon, Julie
;
Feautrier, Celine
;
Souriau, Jean-Charles
... - p. 1-4 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418286
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Development and Characterizations of Fine Pitch Flip-Chip Interconnection Using Silver Sintering</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418286&Exemplar=1&LAN=DE A1 Gougeon, Julie A1 Feautrier, Celine A1 Souriau, Jean-Charles A1 Franiatte, Remi A1 Deschaseaux, Edouard A1 Mendizabal, Laurent A1 Treguer-Delapierre, Mona YR 2023 K1 Silver K1 Electric breakdown K1 Microprocessors K1 Sintering K1 Tomography K1 Reliability K1 Flip-chip devices K1 packaging K1 flip-chip K1 silver sintering K1 fine pitch K1 low temperature SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418286 DO https://doi.org/10.23919/EMPC55870.2023.10418286 SF ELIB - SuUB Bremen
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