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1 Ergebnisse
1
Flip-Chip Interconnects Based on Single Metal-Coated Polyme..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Huynh, Van Long
;
Aasmundtveit, Knut E.
;
Nguyen, Hoang-Vu
- p. 1-5 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418295
RT T1
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
: T1
Flip-Chip Interconnects Based on Single Metal-Coated Polymer Spheres
UL https://suche.suub.uni-bremen.de/peid=ieee-10418295&Exemplar=1&LAN=DE A1 Huynh, Van Long A1 Aasmundtveit, Knut E. A1 Nguyen, Hoang-Vu YR 2023 K1 Temperature measurement K1 Resistance K1 Thermomechanical processes K1 Ink K1 Polymers K1 Bonding K1 Stress K1 Flip-chip interconnects K1 particle deposition K1 Ag sintering K1 low bonding temperature SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418295 DO https://doi.org/10.23919/EMPC55870.2023.10418295 SF ELIB - SuUB Bremen
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