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Flip-Chip Interconnects Based on Single Metal-Coated Polyme..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Huynh, Van Long ; Aasmundtveit, Knut E. ; Nguyen, Hoang-Vu - p. 1-5 , 2023
Link: https://doi.org/10.23919/EMPC55870.2023.10418295