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1
Laser-Assisted Bonding Approach for Photonic Integration Pr..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Vlasov, Aleksandr A.
;
Uusitalo, Topi
;
Lepukhov, Evgenii
... - p. 1-4 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418296
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Laser-Assisted Bonding Approach for Photonic Integration Processes</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418296&Exemplar=1&LAN=DE A1 Vlasov, Aleksandr A. A1 Uusitalo, Topi A1 Lepukhov, Evgenii A1 Virtanen, Heikki A1 Ojanen, Samu-Pekka A1 Viheriala, Jukka A1 Guina, Mircea YR 2023 K1 Temperature sensors K1 Rapid thermal processing K1 System-on-chip K1 Thermal stresses K1 Surface treatment K1 Stress K1 Photonics K1 assembly processes K1 laser-assisted bonding K1 photonic integration K1 silicon devices K1 silicon photonics K1 through-silicon vision K1 infrared imaging K1 infrared microscopy SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418296 DO https://doi.org/10.23919/EMPC55870.2023.10418296 SF ELIB - SuUB Bremen
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