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1
Rapid Sintering of Inkjet Printed Cu Complex Inks Using Las..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Mohan, Nihesh
;
Ahuir-Torres, Juan Ignacio
;
Bhogaraju, Sri Krishna
.. - p. 1-7 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418323
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418323&Exemplar=1&LAN=DE A1 Mohan, Nihesh A1 Ahuir-Torres, Juan Ignacio A1 Bhogaraju, Sri Krishna A1 Kotadia, Hiren A1 Elger, Gordon YR 2023 K1 Laser sintering K1 Sintering K1 Measurement by laser beam K1 Ink K1 Conductivity K1 Laser beams K1 Substrates K1 Cu complex inks K1 Flexible substrate K1 Printed electronics SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418323 DO https://doi.org/10.23919/EMPC55870.2023.10418323 SF ELIB - SuUB Bremen
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