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1 Ergebnisse
1
Thermally Conductive Polymer Composites with Hexagonal Boro..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Duyen Do, Nu Bich
;
Imenes, Kristin
;
Aasmundtveit, Knut E.
.. - p. 1-8 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418324
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Thermally Conductive Polymer Composites with Hexagonal Boron Nitride for Medical Device Thermal Management</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418324&Exemplar=1&LAN=DE A1 Duyen Do, Nu Bich A1 Imenes, Kristin A1 Aasmundtveit, Knut E. A1 Nguyen, Hoang-Vu A1 Andreassen, Erik YR 2023 K1 Encapsulation K1 Powders K1 Medical devices K1 Conductivity K1 Thermal conductivity K1 Thermal management K1 Polymers K1 thermally conductive polymer composites K1 hexagonal boron nitride K1 thermoplastic polyurethane K1 epoxy K1 injection moulding K1 powder bed fusion K1 casting K1 thermal management SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418324 DO https://doi.org/10.23919/EMPC55870.2023.10418324 SF ELIB - SuUB Bremen
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