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1 Ergebnisse
1
Thermal-Mechanical Analysis of a Power Module with Parametr..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Hassan, Sheikh
;
Rajaguru, Pushparajah
;
Stoyanov, Stoyan
. - p. 1-6 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418328
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Thermal-Mechanical Analysis of a Power Module with Parametric Model Order Reduction</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418328&Exemplar=1&LAN=DE A1 Hassan, Sheikh A1 Rajaguru, Pushparajah A1 Stoyanov, Stoyan A1 Bailey, Christopher YR 2023 K1 Interpolation K1 Analytical models K1 Computational modeling K1 PROM K1 Wires K1 Mathematical models K1 Thermal analysis K1 Finite Element Method K1 Thermal-Mechanical Analysis K1 Power Electronics Module K1 Reliability Assessment K1 Parametric Model Order Reduction SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418328 DO https://doi.org/10.23919/EMPC55870.2023.10418328 SF ELIB - SuUB Bremen
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