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1 Ergebnisse
1
Pick and Place of Sensitive Chips with Vacuum-Free Gecomer®..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Lorenz, Lukas
;
Ludewig, Thomas
;
Swiecinski, Kai
... - p. 1-6 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418334
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Pick and Place of Sensitive Chips with Vacuum-Free Gecomer® Tools</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418334&Exemplar=1&LAN=DE A1 Lorenz, Lukas A1 Ludewig, Thomas A1 Swiecinski, Kai A1 Ollmann, Henrik A1 Razkordanisharahi, Amirabbas A1 Bock, Volker YR 2023 K1 Vacuum technology K1 Surface roughness K1 Reproducibility of results K1 Rough surfaces K1 Grippers K1 Surface treatment K1 Standards K1 pick and place K1 MEMS assembly K1 die bond K1 chip bond K1 gripping tool K1 chip handling K1 die sorting SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418334 DO https://doi.org/10.23919/EMPC55870.2023.10418334 SF ELIB - SuUB Bremen
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