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1
Advances in Parylene Adhesive Bonding for the Realization o..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Selbmann, Franz
;
Roscher, Frank
;
Wiemer, Maik
.. - p. 1-6 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418342
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Advances in Parylene Adhesive Bonding for the Realization of Biocompatible Microsystems</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418342&Exemplar=1&LAN=DE A1 Selbmann, Franz A1 Roscher, Frank A1 Wiemer, Maik A1 Kuhn, Harald A1 Joseph, Yvonne YR 2023 K1 Wafer bonding K1 Micromechanical devices K1 Temperature distribution K1 Semiconductor device reliability K1 Atmosphere K1 X-ray diffraction K1 Bonding K1 chip bonding K1 Parylene K1 polymer K1 thermal properties K1 adhesive bonding K1 packaging K1 microsystems K1 MEMS K1 biocompatible K1 microfluidics SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418342 DO https://doi.org/10.23919/EMPC55870.2023.10418342 SF ELIB - SuUB Bremen
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