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Reliability of Copper Sintered Interconnects Under Extreme ..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Bhogaraju, Sri Krishna
;
Ugolini, Francesco
;
Belponer, Federico
.. - p. 1-5 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418348
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418348&Exemplar=1&LAN=DE A1 Bhogaraju, Sri Krishna A1 Ugolini, Francesco A1 Belponer, Federico A1 Greci, Alessio A1 Elger, Gordon YR 2023 K1 Sintering K1 Thermal shock K1 Conductivity K1 Thermal conductivity K1 Reliability K1 Copper K1 Bonding K1 sintering K1 copper flakes K1 reliability K1 SiC K1 die-attach SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418348 DO https://doi.org/10.23919/EMPC55870.2023.10418348 SF ELIB - SuUB Bremen
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