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1 Ergebnisse
1
Thickness Effect of Copper Clips on Power Module Packaging ..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Wan, Haiyong
;
Iosifidis, Nikolaos
;
Zhang, Xu
... - p. 1-5 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418374
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Thickness Effect of Copper Clips on Power Module Packaging Design</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418374&Exemplar=1&LAN=DE A1 Wan, Haiyong A1 Iosifidis, Nikolaos A1 Zhang, Xu A1 Rong, Rui A1 Antoniou, Marina A1 Mawby, Philip YR 2023 K1 Silver K1 MOSFET K1 Silicon carbide K1 Multichip modules K1 Sintering K1 Copper K1 Stress K1 SiC MOSFETs K1 copper clips K1 parasitic inductance K1 thermal stress SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418374 DO https://doi.org/10.23919/EMPC55870.2023.10418374 SF ELIB - SuUB Bremen
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