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1 Ergebnisse
1
Characterization of a Novel Cost-efficient and Environmenta..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Guo, Sihua
;
Martinsen, Kristoffer Harr
;
Nkansah, Amos
... - p. 1-4 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418385
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Characterization of a Novel Cost-efficient and Environmentally Friendly Graphene-enhanced Thermal Interface Material</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418385&Exemplar=1&LAN=DE A1 Guo, Sihua A1 Martinsen, Kristoffer Harr A1 Nkansah, Amos A1 Chen, Jiajia A1 Shen, Zhiyang A1 Murugesan, Murali A1 Zhang, Hongfeng A1 Almhem, Lars A1 Ahtonen, Arto A1 Chen, Jin A1 Liu, Johan YR 2023 K1 Heating systems K1 Graphene K1 Conductivity K1 Thermal conductivity K1 Mechanical factors K1 Thermal stability K1 Elongation K1 Thermal interface material K1 Graphene flakes K1 Cost-efficient K1 Environmentally friendly SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418385 DO https://doi.org/10.23919/EMPC55870.2023.10418385 SF ELIB - SuUB Bremen
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