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1 Ergebnisse
1
Microstructural Based Reliability Investigation of Water- a..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Klengel, Sandy
;
Klengel, Robert
;
Stephan, Tino
- p. 1-5 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418386
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Microstructural Based Reliability Investigation of Water- and Suspension Free Prepared Integrated Electronic Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418386&Exemplar=1&LAN=DE A1 Klengel, Sandy A1 Klengel, Robert A1 Stephan, Tino YR 2023 K1 Silicon carbide K1 Materials reliability K1 Packaging K1 Power electronics K1 Laser beams K1 Plastics K1 Ion beams K1 high resolution analyses K1 microstructure K1 laser preparation K1 ion beam preparation K1 reliability assessment K1 electronic packaging SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418386 DO https://doi.org/10.23919/EMPC55870.2023.10418386 SF ELIB - SuUB Bremen
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