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Deposition of Fine-Pitch Indium Bumps on Single Die:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Schneider, Andreas ; Ghorbanian, Navid ; Burt, David... - p. 1-5 , 2023
Link: https://doi.org/10.23919/EMPC55870.2023.10418408