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1 Ergebnisse
1
Deposition of Fine-Pitch Indium Bumps on Single Die:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Schneider, Andreas
;
Ghorbanian, Navid
;
Burt, David
... - p. 1-5 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418408
RT T1
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
: T1
Deposition of Fine-Pitch Indium Bumps on Single Die
UL https://suche.suub.uni-bremen.de/peid=ieee-10418408&Exemplar=1&LAN=DE A1 Schneider, Andreas A1 Ghorbanian, Navid A1 Burt, David A1 Hollingham, James A1 Booker, Paul A1 Brooks, Toby G. A1 Lipp, John D. A1 French, Marcus J. YR 2023 K1 Radiation detectors K1 Fixtures K1 Apertures K1 Silicon K1 Sensors K1 Indium K1 Flip-chip devices K1 shadow mask K1 indium bumps K1 flip-chip bonding K1 fine-pitch K1 radiation detectors SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418408 DO https://doi.org/10.23919/EMPC55870.2023.10418408 SF ELIB - SuUB Bremen
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