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1 Ergebnisse
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Investigation of Aluminum and Gold Flip-Chip Bonding for Qu..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Cirulis, I.
;
Zschenderlein, U.
;
Braun, S.
... - p. 1-5 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418420
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Investigation of Aluminum and Gold Flip-Chip Bonding for Quantum Device Integration</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418420&Exemplar=1&LAN=DE A1 Cirulis, I. A1 Zschenderlein, U. A1 Braun, S. A1 Radestock, M. A1 Pantou, R. A1 Vogel, K. A1 Selbmann, F. A1 Kurth, S. A1 Wunderle, B. A1 Kuhn, H. YR 2023 K1 Three-dimensional displays K1 Qubit K1 Aluminum K1 Layout K1 Flip-chip devices K1 Bonding K1 Load modeling K1 Aluminum electrodeposition K1 Aluminum flip-chip bonding K1 Thermosonic bonding K1 Gold flip-chip bonding K1 Chip ultrasonic bonding K1 Thermal stress K1 Qubit chip integration K1 Finite Element analysis SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418420 DO https://doi.org/10.23919/EMPC55870.2023.10418420 SF ELIB - SuUB Bremen
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