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1 Ergebnisse
1
Voiding in Parylene-C Encapsulation of Surface Mount LEDs f..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Idil, Ahmad Shah
;
Bailey, Richard
;
Escobedo-Cousin, Enrique
... - p. 1-5 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418444
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Voiding in Parylene-C Encapsulation of Surface Mount LEDs for an Optogenetic Epilepsy Neuroprosthesis</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418444&Exemplar=1&LAN=DE A1 Idil, Ahmad Shah A1 Bailey, Richard A1 Escobedo-Cousin, Enrique A1 Gausden, Johannes A1 O'Neill, Antony A1 Donaldson, Nick YR 2023 K1 Encapsulation K1 Geometry K1 Vapor deposition K1 Surface mount technology K1 Silicon K1 Polymers K1 Substrates K1 optrodes K1 neuroprostheses K1 Parylene-C K1 voids K1 encapsulation K1 micropackaging SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418444 DO https://doi.org/10.23919/EMPC55870.2023.10418444 SF ELIB - SuUB Bremen
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