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1 Ergebnisse
1
Characterizations for eWLB (Embedded Wafer Level Ball Grid ..:
, In:
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
,
Hsieh, Ming-Che
;
Zhang, Frank
;
Zhu, Forest
... - p. 1-5 , 2023
Link:
https://doi.org/10.23919/EMPC55870.2023.10418447
RT T1 <cTitle>2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)</cTitle>: T1 <Title>Characterizations for eWLB (Embedded Wafer Level Ball Grid Array) Antenna in Molded Package Integrations in 77GHz Automotive Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10418447&Exemplar=1&LAN=DE A1 Hsieh, Ming-Che A1 Zhang, Frank A1 Zhu, Forest A1 Liu, Kang A1 Chua, Linda A1 Lin, Yaojian A1 Damalerio, Joel A1 Goh, Hin Hwa A1 Chan, Kai Chong A1 Chen, Zihao YR 2023 K1 Semiconductor device reliability K1 Automotive applications K1 Process control K1 Scattering parameters K1 Reliability K1 Antenna arrays K1 Antenna radiation patterns K1 Fan-out wafer level package K1 FOWLP K1 eWLB K1 antenna in package K1 AiP K1 77GHz K1 automotive SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.23919/EMPC55870.2023.10418447 DO https://doi.org/10.23919/EMPC55870.2023.10418447 SF ELIB - SuUB Bremen
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